Table 3, J-STD-013 Projects - Work in Progress

Project Number

Assigned Number

Description of Activity

Status

P201

J-STD-031

Design standard for BGA applications

Working draft 10%

P202

J-STD-032

Performance standard for BGA bumps and columns

Working draft 95%

P207

IPC-2226

Design tandard for HDI PCBs

Working draft 40%

P208

IPC-6016

Qualification and performance specifiction for HDI layers or boards

Interim final

P209

Qualification and performance specifiction for BGA inorganic mounting structures

Not started

P210

IPC-TM-650

Test methods for qualification and evaluation of BGA mounting structures

Difined in HDI docs

P211

IPC-7075

Requirements for high-pin-count area-array component mounting

First proposal

P212

IPC-7095

Design and assembly process implementation for BGAs

Released

P213

Add to J-STD-029

Test methods for qualification and evaluation of BGA assemblies

Working draft 80%

P214

IPC-7711

Standard for BGA assembly rework and repair techniques

Published

P216

J-STD-004

Qualification and performance of flux used in BGA chip assembly (also IEC 61190-1-1)

Updating required

最好的还有待出台
　　一组专业献身的个人刚完成 IPC-7095, Design and Assembly Process Implementation for BGAs《BGA的设计与制造工艺实施标准》。在Ray Prasad 的领导下，来自 Celestica, Intel, Merix, Amkor, RadiSys, Tektronix, Micron 和 Glenbrook Technology 的专家开发了一个文件，确认所以实施BGA技术的要求。

　　IPC-7095描述了实施BGA和密间距BGA(FBGA)技术的设计与装配的挑战。也叙述了BGA和FBGA对现有技术和元件类型的影响。这个文件的重点在临界检查、修复和与BGA有联系的可靠性问题。

　　IPC-7095 的目标使用者是经理、设计与工艺工程师和从事电子装配、检查与修理过程的操作员和技术员。目的是为那些使用BGA或正考虑实施的人提供有用的和实际的信息。该文件提供了有关裸芯片怎样附着到板层的见解。图二和三显示了在BGA制造中使用的配线绑接(wiring-bonded)和倒装芯片的构造。

除了各种产品描述之外，IPC-7095 也提供了对BGA附着中空洞的信息与讨论。图四显示一个X光用来测定BGA球界面中的空洞的存在和尺寸。

　　更多的有关IPC7095的信息，请联系IPC的顾客服务部，电话：(847) 790-5362。行业应该感谢那些个人的辛勤工作和贡献，他们的名字列在每个标准的致谢页内。

DIETER BERGMAN, is director of technology transfer for the IPC -- Association Connecting Electronics Industries, 2215 Sanders Road, Northbrook, IL 60062; (847) 509-9700; Fax: (847) 509-9798.