通往BGA标准的路标(二) |
| 2009/06/04 |
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定义标准化的要求 Table 3, J-STD-012 Projects - Work in Progress Project Number Assigned Number Description of Activity Status P101 J-STD-026 Semiconductor design standard for flip chip application Released P102 J-STD-027 Mechnical outline standard for flip chip or chip scale configurations Working draft 95% P103 J-STD-028 Performance standard for flip chip/chip scale bumps Released P104 J-STD-029 Test methods for chip scale and BGA products and assembly Working draft 95% P105 Flip chip/chip scale carrier trays(JEDEC) JC 11.5 P106 Bare dice as flip chip or chip scale configuration management standard(JEDEC) JC 11.4 P107 IPC-2225 Design standard for single and multiple chip package printed boards Released P108 IPC-6015 Performace requirements for single and multiple chip package printed board structures Released P109 IPC- Qualification and performance standard for flip chip inorganic mounting structures Not started HM-840? P110 IPC-TM-650 Test methods for qualification and evaluation of flip chip mounting structures Defined in HDI docs P111 IPC-7076 IPC-7078 Requirements for chip scale/chip size component package mounting Requirements for flip chip component package mounting(DCA) Working draft First proposal P112 IPC- Standard for flip chip/chip scale assembly performance requirements Not started P113 Add to J-STD-029 Test methods for qualification and evaluation of flip chip/chip scale assemblies Working draft 80% P114 IPC- Standard for flip chip/chip scale assembly rework and repair Not started P115 IPC- Flip chip/chip scale assembly reliability standard Not started P116 J-STD-030 Qualification and performance of flip chip underfill materials Proposal P117 Qualification and performance of flip chip passivation materials Not started P118 Qualification and performance of flip chip encapsulation materials Not started P119 Qualification and performance for adhesives used in flip chip assembly Not started P120 J-STD-004 |